IEC 60352-5 is the international standard governing solderless press-in connections (often called press-fit) used in electrical and electronic equipment. The current version is Edition 5.0 (2020), which replaced the previous 2012 edition. Overview of the Standard
The standard specifies requirements, test procedures, and practical guidance to ensure that press-fit connections remain electrically stable and mechanically sound under various environmental conditions.
Mechanism: A press-fit connection is formed by inserting a termination (pin) with a compliant "press-in zone" into a plated-through hole of a circuit board.
Purpose: To provide a standardized way to compare test results across different tooling designs and ensure reliability in demanding sectors like telecommunications and automotive. Key Technical Content
Requirements & Testing: Includes test methods for mechanical strength, electrical resistance, and atmospheric resistance (such as humidity and temperature cycling).
Practical Guidance: Contains an informative Annex with assembly and board-design guidance, including hole tolerance ranges and material specifications.
Standardized Reliability: Press-fit technology is noted for being significantly more reliable than traditional soldering in high-stress environments. Recent Changes in Edition 5.0 (2020)
The 2020 revision introduced several significant updates to align with modern manufacturing:
Expanded Scope: The wording was updated from "telecommunication equipment" to more broadly cover "electrical and electronic equipment and components".
Material Flexibility: Updates reflect the use of a wider range of board materials beyond standard printed circuit boards.
Refined Limits: Mechanical and plating limits were refined to match current industrial practices. Accessing the PDF
The full document is a copyrighted technical standard and typically requires purchase from authorized distributors: IEC 60352-5:2020 - iTeh Standards
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Below is a detailed paper based on the technical content of IEC 60352-5: "Free-end winding connections – Solderless wound connections – General requirements, test methods and practical guidance"
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What is the Latest Version?
As of 2024/2025, the active version is IEC 60352-5:2020 (Edition 3.0). This edition consolidated amendments and added rigorous testing for fine-pitch terminals used in miniaturized electronics.
Always verify you are not using the 2012 or 2008 editions, as audit non-conformities have been raised against obsolete versions.
4.3 Tensile (Pull-out) Test (Clause 11)
- Axial force applied to wire in direction that would unwind the connection.
- Minimum force: progression based on wire diameter (e.g., 10 N for 0.5 mm Cu wire).
- Failure defined as wire pull-out > 1 mm or complete separation.
